App.:Digital Electronics

Thickness:0.8mm

Surface treatment:ENIG+OSP

Material:FR4 TG150

Layer:8L HDI(2+4+2)

Location:INDEX > Product > Product Display

App.:Security Electronics

Typical technical specification:

Thickness:1.0mm

Surface treatment:ENIG+OSP

Material:FR4 TG150

Layer:6L

Min. Technical Holes:0.25mm

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